| 摘要 |
PURPOSE:To ensure the packaging of the IC case with high degree of both the heat dissipation and the adhesion without using the heat sink tower by connecting the IC case directly to the substrate via the metal. CONSTITUTION:Metalized layer 43 and 44 are provided to substrate 10 and IC case 11 respectively, and then layer 43 and 44 are adhered together via solder 02 or the like. In such constitution, the heat generated from IC chip 05 flows from the case to the substrate via the metalized layer and the solder. Substrate 10 features a large surface area and thus functions as the heat sink tower, cooling down the substrate if necessary. At the same time, the case is fixed to the substrate, and accordingly the length of lead wires 21-14 plus 33 can be shortened. As a result, the occupied area can be reduced for the IC case. |
