发明名称 MANUFACTURE FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To enable one sealing process, by pressing the external leads to the sealing glass layer provided on the ceramic base, mounting the element on the base, connecting it with the leads, and covering the cap having the glass for ultraviolet ray transmission at the center with thermal welding. CONSTITUTION:At the center of surface of the ceramic base 31, the concave containing the semiconductor pellet 33 is provided, and the surface surrounding it is coated with the sealing low melting point glass layer 37. The lead frame 32 is pressed on the glass layer 37, the pellet 33 is contained in the concave with this condition, and the lead frame 32 and the electrode of the pellet 33 are connected by using the bonding wire 34. After that, at the center, the ultraviolet ray transmission part 33 consisting of high melting point glass of phosphoric acid system excellent in ultraviolet ray transmission is covered, and the ceramic cap 36 having the sealing low melting point glass layer 38 is on the base 31 for the surrounding, and the cap 36 and the base 31 are sealed with heating. Thus, the cost can be reduced.
申请公布号 JPS54129880(A) 申请公布日期 1979.10.08
申请号 JP19780024085 申请日期 1978.03.02
申请人 NIPPON ELECTRIC CO 发明人 KINOSHITA TAKASHI;MAKINO YOSHIAKI
分类号 H01L23/02;H01L23/06;H01L23/10 主分类号 H01L23/02
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