STRUCTURE OF BONDING PAD,申请号JP19780035523-传众专利搜索

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发明名称	STRUCTURE OF BONDING PAD
摘要
申请公布号	JPS54128272(A)	申请公布日期	1979.10.04
申请号	JP19780035523	申请日期	1978.03.29
申请人	HITACHI LTD	发明人	SUMIZAWA KENPO
分类号	H01L21/60	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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