| 摘要 |
PURPOSE:To smoothly release a template from a resin when a mold is opened thereby to enhance the reliability of said resin sealing a semiconductor device by forming a rhodium film at a portion surrounding said resin in said template having a cavity for molding said resin for sealing said semiconductor device. CONSTITUTION:Rhodium films 13, 14 which are not adhesive to a resin sealing a semiconductor device 6 are formed by plating at a position where the resin and a part of a lead frame 5 are surrounded. Accordingly, templates 11, 12 can be smoothly released from the resin because of the rhodium film 13 when the mold is opened, and a mold lubricant is not necessary for the templates 11, 12. |
