发明名称 METHOD OF FABRICATING SEMICONDUCTOR
摘要 <p>A method of manufacturing a semiconductor device comprises the steps of forming an interconnection electrode made of a refractory metal or a silicide of the metal on an insulating film formed on a semiconductor substrate with necessary elements already formed, forming a silicon nitride film on the interconnection electrode, and forming a silicon oxide film on the silicon nitride film, thereby preventing the elements from being deteriorated.</p>
申请公布号 JPS5487175(A) 申请公布日期 1979.07.11
申请号 JP19770155179 申请日期 1977.12.23
申请人 CHO LSI GIJUTSU KENKYU KUMIAI 发明人 HIGASHINAKAGAHA IWAO;SHIMA SHIYOUHEI;MORIYA TAKAHIKO
分类号 H01L23/522;H01L21/285;H01L21/60;H01L21/768;H01L23/532 主分类号 H01L23/522
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