| 摘要 |
PURPOSE:To shorten a mounting process by continuously mounting sensor chips on an insulating sheet-like tape carrier forming an electrode pattern on its surface, cutting off the tape carrier and mounting the cut tape carrier on a base. CONSTITUTION:Electrodes 12 are continuously printed out on the tape carrier 14 consisting of a band-like insulating protection film and small holes 10 for inserting a sensor chip 16 are formed correspondingly to the electrodes 12. The sensor chip 16 is inserted from the rear face of the tape carrier 14 and adhesively fixed with resin. Then, the terminals 16a of the sensor chip 16 are connected to the electrodes 12 through bonding wires 18. The tape carrier 14 is cut off at the intermediate part of the sensor chip 16 to form the unit of a sensor element 20 and mount the element 20 on a base or a structure 22. Consequently, the assembling/mounting process can be rationalized. |
