| 摘要 |
<p>PURPOSE:To make the electrode base body of a glass mold type semiconductor device stable against damp with coherence with a lead wire fitted to it by composing the electrode base body of Mo covered with a W coating. CONSTITUTION:Onto the surface of electrode base body 1 made of a Mo material previously formed into a cylinder of fixed size, W coating 2 is adhered through vapor-phase or liquid-phase plating, thereby obtaining electrode body A. Next, lead wire 3 of a Cu material is fitted to one flank of body A through electric welding. Then, the surface without lead wire 3 of electrode body A is brazed to both sides of rectification unit body B obtaining by stacking a plural number of semiconductor plates 4 via brazing material 5, and then sealed by glass sealing material 6. As a result, since the thermal expansivity of W approximates to that of Mo, the stress to glsss material 6 is small, coherence between lead wire 3 and W coating 2 is excellent, and damp resistance improves.</p> |
