| 摘要 |
{PG,1 A continuous strip of stamped and formed lead frames for a semi-conductor chip comprises a continuous carrier strip having three laterally extending arms integral therewith. One of the arms has a chip receiving surface to which the chip is soldered. The other arms have reversely bent end portions which extend over the chip receiving surface and which are intended to be connected to contact areas on the upwardly facing surface of the chip. Each of the arms has an integral terminal member extending therefrom in the plane of the strip and these terminal members are later bent upwardly relative to the plane of the strip so that they surround the chip receiving surface. The terminal members may comprise rectangular tabs formed by folding the stock metal of the strip and dimensioned to receive complementary contact terminals on the ends of wires thereby to connect the contact areas of the chip to external circuitry. |
