发明名称 MANUFACTURE OF ELECTRONIC DEVICE
摘要 <p>PURPOSE:To secure an easy formation of the display window simultaneously with the resin sealing of the substrate by providing the projection touching the LED set onto the wiring substrate at the concavity of the molding tool. CONSTITUTION:The wiring substrate is inserted to metal mold concavity 6 with electronic parts 2 put downward, and substrate projection bar 7 is hooked to each hooking step part 8. In this case, the substrate is held horizontally within the concavity, and LED3 touches top surface 9a of projection 9. Then fused resin 10 is filled into concavity 6 through pouring. Substrate 1 is drawn out of concavity 6 after solidification of resin 10, thus window edge W remaining as a through-hole.</p>
申请公布号 JPS5469063(A) 申请公布日期 1979.06.02
申请号 JP19770135953 申请日期 1977.11.11
申请人 OMRON TATEISI ELECTRONICS CO 发明人 NISHI HIROYUKI;TSUNETSUGU MASABUMI
分类号 H01L21/56;H01L23/00;H01L23/28;H01L33/56 主分类号 H01L21/56
代理机构 代理人
主权项
地址