首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
COPPER ELECTROPLATING
摘要
申请公布号
JPS5448646(A)
申请公布日期
1979.04.17
申请号
JP19780052621
申请日期
1978.05.01
申请人
OXY METAL INDUSTRIES CORP
发明人
HANSU JIYAAHAADO KURUUTSU;ROI UIRUBAA HAA
分类号
C08G73/04;C25D3/38
主分类号
C08G73/04
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Systems and methods for forming tantalum oxide layers and tantalum precursor compounds
Ligand binding assays for vanilloid receptors
Method of deciding coating condition in manufacturing magnetic recording medium and magnetic recording medium
Method and apparatus for performing a transaction without the use of spoken communication between the transaction parties
Seal
Information playback apparatus, information playback method, and computer readable medium therefor
Method and apparatus for die cutting and making laminate articles
Unloading and stacking system with adjustable backstop
Tube guide for ball screw, ball screw and method for manufacturing thereof
Low-pressure axial direction excitation type f2 laser oscillator
Shoe with drawer
Optical film having controlled scattering/ transmitting characteristics and liquid crystal display using it
Semiconductor device
Method for manufacturing gate electrode for use in semiconductor device
Image forming apparatus
Structural Integrity Monitor
Closed-loop control of wafer polishing in a chemical mechanical polishing system
Power source
Heated pet mat
Multi-key holder with individual docking ports