Polyparabanic acid/copper foil laminates obtained by direct solution casting

摘要

This invention relates to processes and techniques for forming metal and/or plastic/polyparabanic acid (PPA) laminates particularly for use as a component of electrical and electronic systems, especially as flexible circuit materials. Laminate species not requiring intermediate adhesive layers, not fabricated from preformed PPA films and not requiring subsequent cross-linking or other curing reactions are preferred. Solvent casting of PPA is a preferred method of preparing such laminates.