发明名称 |
Method of fabricating a printed circuit board with etched through holes |
摘要 |
A method of fabricating a printed circuit board is disclosed. The method comprises forming a patterned etch resist layer on a metal substrate and selectively etching the substrate to form a through hole with non-linear undercut walls. The etched metal substrate having the resist layer thereon is then coated with a dielectric powder to form a dielectric coat on the substrate having a sufficient through hole edge coverage.
|
申请公布号 |
US4145460(A) |
申请公布日期 |
1979.03.20 |
申请号 |
US19770810461 |
申请日期 |
1977.06.27 |
申请人 |
WESTERN ELECTRIC COMPANY, INC. |
发明人 |
FINLEY, DONALD W.;LEWIS, ROBERT B. |
分类号 |
H05K3/06;H05K3/44;(IPC1-7):B05D5/12;B05D3/10;B05D1/32 |
主分类号 |
H05K3/06 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|