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经营范围
发明名称
PLATING TREATING METHOD
摘要
PURPOSE:To widely improve the efficiency of plating operation without increasing more plating line equipment, by travelling plural strips in parallel and at the same time, plating the surface in molten plating bath.
申请公布号
JPS546824(A)
申请公布日期
1979.01.19
申请号
JP19770072004
申请日期
1977.06.20
申请人
HITACHI LTD
发明人
FURUYAMA BUNJI
分类号
C23C2/00;C23C2/38;C23C2/40
主分类号
C23C2/00
代理机构
代理人
主权项
地址
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