| 发明名称 |
Wafer processing apparatus |
| 摘要 |
<p>A clamping ring (122) and temperature regulated platen (110) for clamping a wafer (15) to the platen (110) and regulating the temperature of the wafer (15). The force of the clamping ring (122) against the wafer is produced by the weight of the clamping ring (122) only. A roof shields all but a few contact regions of the interface between the wafer (15) and clamp from receiving depositing particles so that a coating formed on the wafer makes continuous contact with the clamping ring (122) in only a few narrow regions that act as conductive bridges when the depositing layer is conductive. <IMAGE></p> |
| 申请公布号 |
EP0688042(A1) |
申请公布日期 |
1995.12.20 |
| 申请号 |
EP19950111667 |
申请日期 |
1991.04.09 |
| 申请人 |
APPLIED MATERIALS INC. |
发明人 |
TEPMAN, AVI;GRUNES, HOWARD;ANDREWS, DANA |
| 分类号 |
H01L21/00;H01L21/203;C23C14/50;H01L21/205;H01L21/265;H01L21/302;H01L21/3065;H01L21/683;H01L21/687;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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