ELECTRONIC DEVICE ASSEMBLY ON INSULATING SUBSTRATES

摘要

Application for Patent of Robert W. Beard and Robert B. Johnson for ELECTRONIC DEVICE CONFIGURATION AND METHOD OF MAKING THE SAME An electronic device configuration includes a printed circuit board having conductive circuit traces and a pad thereon, an integrated circuit chip mounted on the pad, a plurality of wires connecting each bonding terminal of the chip to a respective trace, and an epoxy mounted on and completely surrounding the exposed surfaces of the chip and tile wires. The epoxy has a temperature coefficient of expansion approximately equal to that of the wires. A method of making the electronic device includes the steps of plating conductive circuit traces and a pad on a nonceramic board, attaching an integrated circuit chip to the pad, bonding wires from each of the bonding terminals of the chip to a respective one of the traces, and pouring an epoxy over and completely covering the exposed surfaces of the chip and the wires.