| 摘要 |
PURPOSE:To enable signals to be taken out of a multiplicity of terminal pads and to enhance noise decreasing effect by separating a signal through hole arranging region from a power supply through hole arranging region within a chip carrier and arranging a material having high dielectric constant only in the power supply through hole arranging region. CONSTITUTION:Within a small substrate 3, a signal through hole arranging region 10 in which signal through holes 2a are to be arranged is provided on the periphery and a power supply through hole arranging region 11 in which power supply through holes 2b and 2b' are to be arranged is provided at the center. Further, a sheet-type material having high dielectric constant 3 is arranged only at the center of the substrate. Thus, the signal through hole arranging region is separated from the power supply through hole arranging region within a chip carrier and a coupling capacitor is provided only in the power supply through hole region. According to such arrangement, signals can be propagated with low noise and at a high speed. |
