| 发明名称 |
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| 摘要 |
Electroless plating of high grade steel, particularly wire, with Cu or Cu-Sn, to facilitate cold-deformation takes place by first treating the steel surfaces with aqs. solutions containing non-oxidising mineral acids, and 30-100 g/l Na hypophosphite and then with known solutions for electroless deposition of Cu-containing metal layers. - Pref. steel surfaces are treated with aqs. solutions containing 90-140 g/l HCl and 30-100 g l NaH2PO2 and more pref. also 170-350 g/l H2SO4, at 15-80 degrees C for 5-15 min., and subsequently Cu-plated from aqs. solutions containing 1-20 g/l Cu, 1-10 g/l chloride, 15-400 g/l H2SO4 and 0.01-3 g/l inhibitor. |
| 申请公布号 |
DE1965642(C3) |
申请公布日期 |
1978.10.19 |
| 申请号 |
DE19691965642 |
申请日期 |
1969.12.31 |
| 申请人 |
GERHARD COLLARDIN GMBH, 5000 KOELN |
发明人 |
GOTTA, HANS, DIPL.-CHEM. DR., 5023 WEIDEN;SPEI, BRIGITTE, 5000 KOELN |
| 分类号 |
C23C18/18;C23C18/38;(IPC1-7):C23C3/02 |
主分类号 |
C23C18/18 |
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