Socket connecting semiconductor chip to metallic frame - has elevations on area where chip is contacted with solder surrounding contact point

摘要

The semiconductor socket connects a semiconductor chip with a metallic socket. The chip is engaged at a uniform height in the socket and is parallel to the walls of the socket by the intervention of a semiconductor device. The socket has a chip fixing section and is used for fitting the semiconductor device. There are elevations of equal height in the section where the chip is fixed. These elevations are used as the support for the semiconductor device so that it is held at a uniform level parallel to the socket while the chip is being attached. The elevations are surrounded by a soldering agent which is used to attach the semiconductor device to the socket.