发明名称 |
SEMICONDUCTOR INTEGRATED CIRCUIT |
摘要 |
PURPOSE:To lower the cost of ICs packaged by a face-down bonding method by using multiplayer metal films of an alloy of Al or Al-Si and Cr and CuAu for electrode wirings of the ICs. |
申请公布号 |
JPS5393775(A) |
申请公布日期 |
1978.08.17 |
申请号 |
JP19770008042 |
申请日期 |
1977.01.27 |
申请人 |
SUWA SEIKOSHA KK |
发明人 |
OGATA TOSHIAKI |
分类号 |
H01L21/60;H01L21/3205;H01L23/12;H01L23/52;H01L29/40 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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