| 摘要 |
<p>PURPOSE:To reinforce a lead frame and avoid deformation of the lead frame by a method wherein plastic molding parts are provided on the bent parts of the lead frame. CONSTITUTION:An electronic component 1 is bonded to a lead frame 3 with adhesive 5 and electric connections are provided with wires 4. The electronic component 1 and the wires 4 are molded with plastic to form a plastic molding part 2a. The bent parts 3a of the lead frame 3 exposed from the plastic molding part 2a are also molded with plastic to form plastic molding parts 2b independent from the plastic molding part 2a. Finally, the lead frame 3 is cut and formed into the shape of a product.</p> |
