| 摘要 |
According to an embodiment of the present invention, a printed circuit board (PCB) is provided. The PCB comprises: an insulation layer; and a pattern layer placed on at least one surface of the insulation layer, wherein the pattern layer includes a circuit pattern and a residual pattern electrically disconnected to the circuit pattern. The present invention provides a PCB, with a simplified manufacturing process, an improved circuit pattern, and alleviated via malfunction. |
