| 摘要 |
The electrode leads extending from the body of a capsule enclosing a heat-generating semiconductor device are plugged into a connector socket affixed to a circuit board and the mounting tab of the capsule is connected by a screw in good heat-conducting contact to a heat-dissipating metal plate attached to the circuit board, the capsule being prevented from moving laterally when the screw is tightened by two spaced blocks positioned on the metal plate at the sides of the capsule body.
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