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发明名称
SEMICONDUCTOR DEVICE
摘要
<p>PURPOSE:To increase the size of bonding pads and improve yield by separating bonding pads from metal wiring parts through a low temperature CVD nitride film.</p>
申请公布号
JPS5344171(A)
申请公布日期
1978.04.20
申请号
JP19760119126
申请日期
1976.10.04
申请人
SUWA SEIKOSHA KK
发明人
YAMADA AYAO
分类号
H01L23/52;H01L21/3205;H01L21/60
主分类号
H01L23/52
代理机构
代理人
主权项
地址
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