| 摘要 |
PURPOSE:To improve the heat resistance by compounding polyphenylene sulfide ketone with a specific polyphenylene sulfide. CONSTITUTION:A polyphenylene sulfide ketone having a melt flow rate (ASTM D 1238-74,360 deg.C, 5kg load) of 1X10<4>-4X10<4>g/10min is compounded with a crosslinked polyphenylene sulfide having a melt flow rate lower than that of said ketone at the same temp. condition and of pref. 1X10<4>-3X10<4>/10min, and if necessary a filler, another resin, a coupling agent, a surface treating agent, an antioxidant, a lubricant, a coloring agent, etc., fused and mixed at 260-420 deg.C. |
