| 发明名称 |
MULTILAYER WIRING STRUCTURE |
| 摘要 |
PURPOSE:To make adhesiveness firm and prevent the delamination of wiring layers by interposing a polyimide layer mixed with fine powder of SiO2 or Al2O3 between wiring layers and polyimide resin being an interlayer insulation film. |
| 申请公布号 |
JPS5315786(A) |
申请公布日期 |
1978.02.14 |
| 申请号 |
JP19760089106 |
申请日期 |
1976.07.28 |
| 申请人 |
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发明人 |
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| 分类号 |
H05K3/46;H01L21/283;H01L21/768;H01L23/522;H05K1/00 |
主分类号 |
H05K3/46 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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