| 摘要 |
An integrated circuit including a first signal line disposed on a semiconductor substrate, a second signal line disposed on a first dielectric layer, the first dielectric layer disposed on the semiconductor substrate, a third signal line disposed on a second dielectric layer, the second dielectric layer disposed on the first dielectric layer, and at least two vias connecting the first signal line to the second signal line, wherein the second signal line does not span the region directly beneath the third signal line, and wherein at least a portion of the first signal line extends into the region directly beneath the third signal line.
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