| 摘要 |
Improved wire bonds between circuit points of such apparatus as semiconductor devices and integrated circuit units are accomplished by bonding one end of a wire to one of the circuit points and then paying out from a tool through which the wire is threaded, a length of wire sufficient to form a loop between the first bond point and the second bond point. That having been done, the wire is prevented from paying out of, or back into, the tool while the tool and the wire are lowered to the second bond point where the second bond is completed.
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