| 发明名称 |
PRODUCTION OF ORGANIC RESIN INSULATED WIRING |
| 摘要 |
PURPOSE:To obtain sharp and fine through-holes by interposing a porous Al2 O3 film between the polyimide resin layer to be formed with through-holes and an Al wiring layer and performing etching in that state. |
| 申请公布号 |
JPS52156555(A) |
申请公布日期 |
1977.12.27 |
| 申请号 |
JP19760073177 |
申请日期 |
1976.06.23 |
| 申请人 |
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发明人 |
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| 分类号 |
H05K3/46;H01L21/283;H01L21/31;H01L21/768;H01L23/522;H01L49/02 |
主分类号 |
H05K3/46 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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