| 发明名称 |
Multi-point microprobe for testing integrated circuits |
| 摘要 |
A multi-point probe for contacting closely spaced pads of a semiconductor device, having a flexible sheet-like member which carries the probes that make contact with the semiconductor device.
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| 申请公布号 |
US4065717(A) |
申请公布日期 |
1977.12.27 |
| 申请号 |
US19730380859 |
申请日期 |
1973.07.19 |
| 申请人 |
SIGNETICS CORPORATION |
发明人 |
KATTNER, LIONEL E.;YOUMANS, ALBERT P.;SHASBY, PATRICK J. |
| 分类号 |
G01R1/067;G01R1/073;(IPC1-7):G01R1/06;G01R31/26 |
主分类号 |
G01R1/067 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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