| 摘要 |
Equipment for manufacturing a semiconductor device is provided to maximize productivity by preventing a ring seal from colliding with the inner surface of a chamber to prevent the generation of particles. Equipment for manufacturing a semiconductor device includes a loadlock chamber, a process chamber, a chuck, a ring seal(124), a plurality of cylinders(130), an air supply unit(140), an air exhaust unit(150), and a plurality of air tubes(160). The loadlock chamber receives a wafer temporarily. The process chamber is formed at one side of the loadlock chamber. The chuck is formed at the lower part of the process chamber to support the wafer. The ring seal separates the wafer from the loadlock chamber or outside. The plurality of cylinders support and operate the ring seal. The air supply unit and the air exhaust unit supply and exhaust air to/from the plurality of cylinders. The plurality of air tubes are diverged from the air supply unit and the air exhaust unit, and are connected to the plurality of cylinders to supply and exhaust the same amount of air.
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