| 摘要 |
<p>1425298 Electroless Cu plating PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd 3 April 1974 [4 April 1973] 14804/74 Heading C7F An aqueous electroless Cu plating bath contains (1) a soluble Cu<SP>++</SP> salt (2) a constituent to establish the pH (3) a reducing agent, and (4) as Cu<SP>++</SP>- complexing agent at least one organic compound which contains at least two groups selected from phosphinic and phosphonic acid groups. Compound (4) may be, where X = H, OH, R 1 and R 2 = H, alkyl, hydroxyalkyl, methyl phosphonic, methyl phosphinic, or alkylcarboxyl, and R 3 to R 6 = H, alkyl of # 4 C, (subsituted) aryl or aralkyl, R 7 = -(CH 2 ) n - where n = 2-4, 1, 2 cyclohexyl or -(CH 2 ) 2 N(R 8 )(CH 2 ) 2 - where R 8 = R 3 . When (3) is HCHO and the pH is 10-14, (4) may be, and when (3) is dialkyl aminoborane and the pH is 6-11, (4) may be, other compounds (4) are, and, where R = alkyl, aryl, or aralkyl; (1) may be CuSO 4 and (2) NaOH; the bath may also contain triethanolamine or nitrilotripropanol or a polyoxyalkylene compound with #4 oxyalkylene groups, e.g. an ethoxylated phosphate ester. The substrate may be glass, pre-treated conventionally with SnCl 2 /PdCl 2 .</p> |
