Heat dissipating device for transistor with outwardly extending heat conductive tab

摘要

The device comprises a body portion formed of a pair of substantially parallelly situated planar members spaced to receive the tab therebetween such that the interior surface of each member is parallel to and in engagement with the exterior surface of the tab adjacent therewith. In this manner, optimum heat transfer is achieved because the surface area of contact between the members and the tab is maximized by causing both sides of the tab to be in a heat conductive relationship with the device. Resilient connecting means situated at the ends of the members variably space the planar members with respect to each other such that tabs of different thicknesses can be accommodated and at the same time the parallel relationship between the members is maintained regardless of the spacing of the members to assure that the contact area is always maximized.