| 摘要 |
1,272,021. Semi-conductor devices. MOTOROLA Inc. 25 July, 1969 [2 Aug., 1968], No. 37537/69. Heading H1K. Those portions 33 of a metallic frame used in the manufacture of a plurality of semi-conductor devices 35 which are to form external leads of the completed devices are provided with tapered preformed tips 36 shaped, for example, to fit sockets on a printed circuit. Another frame (Figs. 1 and 2, not shown) provides dual in-line lead assemblies for integrated circuits. In both frames connecting portions (13), 32 which hold the leads together during processing form with the leads barriers to prevent the spread of flash during the provision of plastics encapsulation. |
