| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
PURPOSE:To obtain good contact and to save Au by flowing AuGe alloy fused solder on the junction surface of Ni plated tip during bonding. |
| 申请公布号 |
JPS5276875(A) |
申请公布日期 |
1977.06.28 |
| 申请号 |
JP19750153062 |
申请日期 |
1975.12.22 |
| 申请人 |
FUJITSU LTD |
发明人 |
HAYASHI KUNIHIKO;SUGAWARA TAKEHISA |
| 分类号 |
H01L21/52;H01L21/58;H01L23/12 |
主分类号 |
H01L21/52 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
