发明名称 |
Hybrid integrated circuit including thick film resistors and thin film conductors and technique for fabrication thereof |
摘要 |
A technique for the fabrication of hybrid integrated circuitry combining the expedients of thick and thin film technology is described. A novel processing sequence for attaining ohmic contact between thick film resistors and thin film conductive metallization involves the use of an interphase gold tab as a conductive link.
|
申请公布号 |
US4031272(A) |
申请公布日期 |
1977.06.21 |
申请号 |
US19750576100 |
申请日期 |
1975.05.09 |
申请人 |
BELL TELEPHONE LABORATORIES, INCORPORATED |
发明人 |
KHANNA, SATYA PAL |
分类号 |
H01C1/142;H01C7/00;H01C17/28;H05K1/09;H05K1/16;H05K3/14;(IPC1-7):H01C7/00;B05D5/12 |
主分类号 |
H01C1/142 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|