AGGREGAT INNEFATTANDE ETT DISTANSELEMENT.

摘要

A mounting assembly for an integrated circuit comprises a synthetic-resin flexible spacer body having a face and unitarily formed with a pair of end regions having a predetermined height above the face and with a central region bridging the end regions and having a maximum height above the face smaller than the height of the end regions by a distance at most equal to the thickness of the integrated-circuit package to be mounted. Each of the end regions is formed with the throughgoing hole alignable with a similar hole in a heatsink plate and in a circuit board so that screws passing through each of these holes can clamp the end regions between the rigid heatsink plate and the circuit board with the central region pressing the integrated-circuit package resiliently against the heatsink plate.