Barrier formation in semiconductor - by cutting slot in semiconductor and then diffusing two layers simultaneously on its either side

摘要

The barrier formation in a semiconductor provides isolation without the disadvantages of deep diffusion. Central areas are isolated from peripheral regions preventing arcing to ground. Formation of the barrier is by cutting a slot (20) in the semiconductor. Two layers (2, 3, 21) are then simultaneously diffused either side of the semiconductor and around the slot itself. The slot is cut, preferably with a diamond saw, to a depth of about one hundred microns, the diffusion depth being of the order of seventy microns. diffusion is followed by an annealing stage and cutting into basic chips.