| 发明名称 |
INSULATING BOARD FOR PLATING |
| 摘要 |
PURPOSE:An insulating board for plating coated with metallic foil releasable physically, suitable for manufacturing printed circuit boards by the additive process. |
| 申请公布号 |
JPS5222078(A) |
申请公布日期 |
1977.02.19 |
| 申请号 |
JP19750098736 |
申请日期 |
1975.08.13 |
| 申请人 |
NOMURA HIROTOSHI |
发明人 |
NOMURA HIROTOSHI |
| 分类号 |
B32B15/04;B05D5/00;B32B15/08;C23C18/16;C23C18/20;C23C18/31;C23C18/34;C23C18/40;H05K1/00;H05K3/18;H05K3/38 |
主分类号 |
B32B15/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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