发明名称 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a printed circuit board and a method of manufacturing the same.SOLUTION: A printed circuit board includes: a core part including a glass plate and resin layers disposed on an upper surface and a lower surface of the glass plate; and a wiring layer disposed on at least one of an upper portion and a lower portion of the core part. The core part includes a groove part penetrating from the upper surface to the lower surface of the glass plate while being separate from a side surface of the core part by a predetermined distance.SELECTED DRAWING: Figure 1a
申请公布号 JP2016092402(A) 申请公布日期 2016.05.23
申请号 JP20150181086 申请日期 2015.09.14
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 CHO SUK HYEON;BAEK YONG HO;KO YOUNG GWAN;OH YOONG;KO YOUNG KUK
分类号 H05K1/02;H05K3/46 主分类号 H05K1/02
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