发明名称 |
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board and a method of manufacturing the same.SOLUTION: A printed circuit board includes: a core part including a glass plate and resin layers disposed on an upper surface and a lower surface of the glass plate; and a wiring layer disposed on at least one of an upper portion and a lower portion of the core part. The core part includes a groove part penetrating from the upper surface to the lower surface of the glass plate while being separate from a side surface of the core part by a predetermined distance.SELECTED DRAWING: Figure 1a |
申请公布号 |
JP2016092402(A) |
申请公布日期 |
2016.05.23 |
申请号 |
JP20150181086 |
申请日期 |
2015.09.14 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
CHO SUK HYEON;BAEK YONG HO;KO YOUNG GWAN;OH YOONG;KO YOUNG KUK |
分类号 |
H05K1/02;H05K3/46 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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