| 摘要 |
PROBLEM TO BE SOLVED: To achieve flip-chip mounting of a high reliability by improving the accuracy in the position and geometry of a bump. SOLUTION: In a semiconductor device of this embodiment, the bump 14 in the shape of doubly stacked cylinders or of concave cross section is provided on an electrode pad 12 formed on a main plane of a semiconductor chip 10. In other words, this bump 14 is composed of a cylinder-shaped pedestal part 14a and a cylinder-shaped tail part 14b of a smaller diameter than that of the pedestal base part 14a. The top face of the tail part 14b (the top face of the bump) and the top face of the pedestal part 14a are flat, respectively. This bump 14 is formed by a resist (a photolithography) technique and a plating technique, for example, by gold plating. |
