| 摘要 |
PURPOSE:To restrict the terminal resistance during the measurement by a method wherein a package spring is provided to depress a semiconductor device package on a heat sink side. CONSTITUTION:When a cover 12 is closed for inserting a lock lever 26 into a recession 31 to be locked, a depressing part 27 depresses lead terminals 22 on contact pins 19 side. Additionally, the bent part 29 of a leaf spring 28 depresses the package 32 of an IC 21 to be measured on a heat sink 18 side. Through these procedures, the lead terminals 22 are brought into contact with the contact pins 19 without fail. Accordingly, when electric signals are transmitted from the pins 19 to the lead terminals 22, various electrical characteristics of the IC 21 can be measured. At this time, the test results due to the defective contact during the test can be prevented from being brought about. Furthermore, the heat is sufficiently dissipated from the package 32 to the heat sink 18 so that the thermal resistance of the IC 21 to the heat sink 18 may be lowered thereby enabling said IC 21 to be measured for a long time. |
