| 摘要 |
PROBLEM TO BE SOLVED: To reduce the resistance between a chip capacitor and a metal housing, and to reduce costs of a substrate in a pressure sensor using the chip capacitor to remove the noise which is input from the outside. SOLUTION: One end 51 of a conducting terminal 50 having a bent part 53 is bonded to a pad 34 being electrically connected to a second electrode 33a of the chip capacitor 33 mounted on one surface side of the substrate 30. When the other surface side of the substrate 30 is brought to adhere to the metal housing 10 through an adhesive 90 so as to be fixed thereto, the other end 52 of the conducting terminal 50 is pressed against the metal housing 10 by using an elastic force of the bent part 53, thereby making the chip capacitor 33 and the metal housing 10 electrically conductive. COPYRIGHT: (C)2008,JPO&INPIT
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