METHOD OF MANUFACTURING PACKAGING STRUCTURE, AND CONNECTOR

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a packaging structure of high reliability wherein a shortcircuit is not generated between connecting parts which are adjacent to each other even if a gap between terminal electrodes of a semiconductor device becomes narrow, and to provide a connector. SOLUTION: In the manufacturing method, through holes 11 are formed in a resin film 7 and a lifting sheet 10 on the terminal electrodes 8 of a circuit board 9, and the through holes 11 are filled with a conductive adhesive 13; the lifting sheet 10 is exfoliated; projection electrodes 3 of the semiconductor device 1 are aligned on the conductive adhesive 13; and packaging is performed. The pierced hole 11 is formed as an inverse tapered shape wherein the diameter of a circuit board 9 side is greater than that of a semiconductor device 1 side. As a result, spreading of the conductive adhesive 13 by pushing at the time of packaging is restrained. COPYRIGHT: (C)2005,JPO&NCIPI