| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface mount type electronic component wherein electrodes on an upper and a lower surfaces of a case substrate can be electrically connected easily without using a side surface electrode and a viahole electrode. SOLUTION: This surface mount type electronic component is provided with the case substrate 1, an electronic component element 10 mounted on the case substrate 1, and a cap 20 which is fixed on the case substrate 1 so as to cover the electronic component element 10. The case substrate 1 is constituted of a laminate in which a plurality of ceramics layers are so laminated that laminating surfaces are aligned perpendicularly to the upper and the lower surfaces of the case substrate 1. First and second internal electrodes 7, 8 wherein parts of them are exposed to the upper and the lower surfaces of the case substrate are arranged between the ceramics layers. First and second external electrodes 2, 3 are formed on exposed parts 7a, 8a of the first and the second internal electrodes 7, 8 which parts 7a, 8a are exposed to the upper surface of the case substrate 1 so as to make electrical continuity. Third and fourth external electrodes 4, 5 are formed on exposed parts 7a, 8a of the first and the second internal electrodes 7, 8 wherein parts 7a, 8a are exposed to the lower surface of the case substrate 1 so as to make electrical continuity. The electronic component element 10 is connected between the first and the second external electrodes 2, 3.
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