| 摘要 |
PROBLEM TO BE SOLVED: To provide an improved method for positioning a die module array. SOLUTION: The method for positioning the die module array includes forming a physical reference surface directly on an individual silicon die module, providing a temporary holder including an alignment tool, arranging a die on the temporary holder by abutting the physical reference surface against the alignment tool, temporarily fixing the die arranged on the temporary holder, and bonding a permanent substrate to the die arranged on the temporary holder. COPYRIGHT: (C)2009,JPO&INPIT |
