ABRASIVE FOR SILICON WAFER

摘要

PROBLEM TO BE SOLVED: To obtain an abrasive which does not cause haze at the end of a final precision polishing step by adding a specified amount of an ethylene oxide adduct of p-cumenylphenol having an HLB in a specified range to alkaline colloidal silica having a specified average particle size. SOLUTION: An ethylene oxide adduct of p-cumenylphenol having an HLB of 13.0 or higher but lower than 20 is added to alkaline colloidal silca having an average particle size of 7-100μm in an amount of the adduct of 1 ppm to 1.0 wt.% of solid silica contained in the colloidal silica. A colloidal silica having, e.g. an average particle size, measured by the nitrogen adsorption method (BET method), of 7-100μm is used. Preferably, silica is diluted with water to a concentration of 0.1-20 wt.% before being used. Using this abrasive enables a haze-free silicone wafer surface to be easily obtained without the necessity for any special operation or any improvement in apparatus.