发明名称 |
ELECTROLESS METAL DEPOSITION |
摘要 |
An improved method for enhancing the ductility of electroless metal deposits is provided in which an electroless metal bath contains an extraneous ion which has a preferential capacity for being coulombically adsorbed at the outer layer of an electric double layer present on an interface in contact with such bath on which said metal is electrolessly depositing, such ion being present in an amount sufficient to reduce the inclusion of hydrogen in the electrolessly deposited metal.
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申请公布号 |
US3635758(A) |
申请公布日期 |
1972.01.18 |
申请号 |
USD3635758 |
申请日期 |
1969.08.04 |
申请人 |
PHOTOCIRCUITS CORP. |
发明人 |
FREDERICK W. SCHNEBLE JR.;JOHN F. MCCORMACK;RUDOLPH J. ZEBLISKY |
分类号 |
C23C18/40;(IPC1-7):B44D1/18;C23C3/02 |
主分类号 |
C23C18/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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