| 摘要 |
PROBLEM TO BE SOLVED: To obtain an excellent heat radiation characteristic by not forming any reinforcing layer, on a part of the surface and/or of the rear face of a very flexible heat radiating base material having a specified C-hardness which is to be brought into contact with an exothermic electronic component, and between that part of the surface and/or of the rear face and a part of the opposite face in the heat radiating direction corresponding to the part of the surface and/or of the rear face to be brought into contact with the electronic component. SOLUTION: A very flexible heat radiating base material has flexibility of a C-hardness of 50 or below. On a part of the surface and/or of the rear face of the material which is to be brought into contact with an exothermic electronic component and between that region and a region on the opposite face in the heat radiating direction corresponding to the region to be brought into contact with the electronic component, there is no reinforcing layer formed. The reinforcing layer is formed near the periphery of the surface and of the rear face and/or in the entire part or a part of the inside material under the peripheral part of the surface and of the rear face. There is no special restrictions on the thickness and the material of the reinforcing layer and PET, PE, polyamide, polyimide, or the like is usually used. Due to this structure, the load on the exothermic electronic component is made small when assembling the entire device in an electronic equipment and an excellent heat radiation characteristic can be realized.
|
