| 摘要 |
<p>PURPOSE:To improve mass productivity by making the lowermost layer, which includes the substrate metallic film to become the common electrode in electric plating, out of the material soluble to a solvent or etchant. CONSTITUTION:A substrate metallic film 22 such as Cr, Cu, etc., is made in the thickness of approximately 0.8mum on a base substrate 21. Next, a soluble polyimide film 23 is applied in the thickness of approximately 30mum on it, and it is processed to make a groove by oxygen plasma. Next, a conductor 24 such as copper, etc., is charged in the groove by electric plating so as to make via hole wiring. Successively, in the upper layer, a substrate metallic film is provided at the part opposed to the bottom of an X-layer wiring conductor, and in the upper layer, an unsoluble polyimide 25 is formed in the thickness of approximately 20mum as a permanent insulating film, and similarly, it is processed to made a groove in the shape of an X-layer wiring pattern. And since the substrate metallic film 22 in the shape of an X-layer wiring pattern connected to via hole conductor copper is exposed at the bottom of the groove, electric plating is performed with this as an electrode to make X-layer wiring conductor copper. Furthermore, the soluble polyimide film 23 is removed by a solvent, and the substrate metallic film 22 is removed by etching.</p> |
