发明名称 CIRCUIT CONNECTING MATERIAL AND METHOD FOR CONNECTING CIRCUIT TERMINAL USING THE SAME AS WELL AS CONNECTING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a circuit connecting material for electric or electronic circuit capable of obtaining good adhesive strength even by a specific coating material of a circuit connecting member having a different strength according to a type of the material for constituting the circuit for connecting, and to provide a method for connecting the circuit terminal using the same as well as a connecting structure. SOLUTION: The circuit connecting material is interposed between opposed connecting terminals to pressurize the opposed terminal to electrically connect between the terminals of a pressurizing direction. The connecting material comprises (1) a dicyanodiamide, (2) and epoxy resin, (3) a latent curing agent as indispensable components, and (4) a film. The method for connecting the circuit terminal comprises the steps of disposing a first circuit member having a first connecting terminal, and a second circuit member having a second connecting terminal. The first connecting terminal is opposed to the second connecting terminal. The circuit connecting material is interposed between the opposed first member and second member, and electrically connect the first terminal to the second terminal disposed oppositely after heating and pressurizing.
申请公布号 JP2002204052(A) 申请公布日期 2002.07.19
申请号 JP20000399826 申请日期 2000.12.28
申请人 HITACHI CHEM CO LTD 发明人 ARIFUKU MASAHIRO;WATANABE ITSUO;FUJINAWA MITSUGI;KOBAYASHI KOJI;NAKAZAWA TAKASHI;KOJIMA KAZUYOSHI
分类号 C09J9/02;C09J133/00;C09J163/00;C09J163/02;H05K3/28;H05K3/32;(IPC1-7):H05K3/32 主分类号 C09J9/02
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